Join Us in Ningbo, China!
2024 IEEE International Workshop
on Advanced Interconnects
November 6 – 8. 2024
Ningbo, China
Important Dates
IMPORTANT
TIME
• One-page Abstract Submission
Extended to Oct. 20, 2024
• Special Session, Workshop/Tutorial Proposal
Sept. 30, 2024
• Notification of Acceptance
Oct. 21, 2024
Keynote Speakers
Dr. Jianming Jin
IEEE Fellow
Y. T. Lo Chair Professor of University of lllinois at Urbana-Champaign
Executive Dean of Zhejiang University-University of lllinois at Urbana-Champaign Institute
Dr. Yihong Qi
IEEE Fellow
Fellow of the Canadian Academy of Engineering
Fellow of the National Academy of Inventors
Dr. Wen-Yan Yin
IEEE Fellow
Zhejiang University Distinguished Professor
Dr. Boping Wu
Vice President of JCET Group
General Manager of Design Service Business Unit
Industry Plenary
Kai Kang
University of Electronic Science
and Technology of China
Kezhou Li
Cadence
Xuechuan Han
Shennan Circuits Co., Ltd.
Jianguo Zhang
Sanechips
Rongyao Tang
Fiberhome Communication
Technology Co.
Yinglei Ren
Intel
Zhenwei Zhao
Dawning Information
Industry Co., Ltd
2024 IEEE International Workshop on Advanced Interconnects
(WAI 2024)
2024 IEEE International Workshop
on Advanced Interconnects
(WAI 2024)
Organizing Committee
Meeting information
WAI 2024 General Chair

Jun Fan (Fellow, IEEE) received the B.S. and M.S. degrees in electronic engineering from Tsinghua University, Beijing, China, in 1994 and 1997, respectively, and the Ph.D. degree in electrical engineering from the Missouri University of Science and Technology (formerly University of Missouri-Rolla), Rolla, MO, USA, in 2000.

From 2000 to 2007, he was with NCR Corporation, San Diego, CA, USA, as a Consultant Engineer. In July 2007, he joined the Missouri University of Science and Technology and became a tenured Professor in 2016. From October 2018 to August 2020, he was the Cynthia Tang Missouri Distinguished Professor in computer engineering. He was the Director of the Missouri S&T EMC Laboratory, and the Director of the National Science Foundation (NSF) Industry/University Cooperative Research Center (I/UCRC) for Electromagnetic Compatibility (EMC) from 2013 to 2020. He was a Senior Investigator of Missouri S&T Material Research Center. His research interests include hardware design and fundamental research for electromagnetic compatibility (including signal and power integrity) at the levels of integrated circuit, package, PCB and system, and development of specialized design tools and innovative measurement technologies. He was the recipient of the IEEE EMC Society Technical Achievement Award in August 2009 and the Richard R. Stoddart Award for Outstanding Performance in 2022.

Er-Ping Li (Fellow, IEEE) received the Ph.D. degree in electrical engineering from Sheffield Hallam University, Sheffield, U.K., in 1992., He is currently a Changjiang-Qianren Distinguished Professor with the Department of information Science and Electronic Engineering, Zhejiang University, Hangzhou, China, and the Dean of the Joint Institute of Zhejiang University— University of Illinois at Urbana-Champaign, Zhejiang University.

Since 1989, he has been a Research Fellow, a Principal Research Engineer, an Associate Professor, and a Technical Director with the Singapore Research Institute and University, Singapore. He has authored or coauthored more than 500 papers published in the referred international journals and conferences, authored two books published by John-Wiley-IEEE Press and Cambridge University Press. He holds and has filed a number of patents at the U.S. patent office. His research interests include electrical modeling and design of micro/ nanoscale integrated circuits, three-dimensional electronic package integration, and nanoplasmonic technology.

Dr. Li is a Fellow of the Singapore Academy of Engineering and the USA Electromagnetics Academy. He was the recipient of the IEEE EMC Technical Achievement Award, in 2006, Singapore IES Prestigious Engineering Achievement Award, and Changjiang Chair Professorship Award, in 2007, 2015 IEEE Richard Stoddard Award on EMC, 2021 IEEE EMC Laurence G. Cumming Award, and Zhejiang Natural Science 1st Class Award.