Challenges and Solutions for PCB Manufacturing in 224G Applications.
( 224G应用下 PCB 制造的挑战及应对方案。)

Xuechuan Han, Director of Product R&D of Shennan Circuits Co., Ltd. He mainly engaged in PCB key technology mechanism research, model construction, new products and technology research, promotion to batch application, for the company's insight into new business opportunities and directions, the ability to reserve new products and technologies in advance, as well as the key technical capabilities to enhance and optimize.
( 韩雪川，深南电路股份有限公司产品研发总监，主要从事 PCB 关键技术的机理研究、模型 建设以及新产品新技术的研发、推广到批量应用，为公司洞察新的业务机会和方向、提前储 备新产品技术的能力以及关键技术能力的提升和优化。)

Due to the AI wave, the amount of data has surged and the need for efficient data transmission has increased dramatically. It is an inevitable trend to increase the signaling rate of a single channel. It is expected that single-channel 224G solutions will see deployment uptake in 2026. Due to the increased rate, 224G solutions face higher challenges in terms of loss, return loss, and crosstalk. For SerDers, chip packaging, PCB, connectors and other components have put forward higher requirements.
Facing the challenges of 224G in terms of loss, vias bandwidth, crosstalk, etc., the enhancement of PCB processing capability is especially critical, and the brownout process, stub length control, vias size, layer bias control, impedance control, etc. have a key impact on the signal integrity of 224G. This report analyzes the challenges faced by 224G on the PCB side, and shows the solutions we have already accomplished or are working on for these challenges.
( 由于 AI 浪潮的推动，数据量激增，数据的高效传输的需求也大幅增加。提升单通道的信号传输速率 是必然趋势。预计单通道 224G 的方案将在 2026 年迎来部署上量。由于速率的提升，224G 方案在损 耗、回损、串扰等方面面临更高的挑战。对于 SerDers、芯片封装、PCB、连接器等各个组件均提出 了更高的要求。
面对 224G 在损耗、过孔带宽、串扰等方面的挑战，PCB 加工能力的提升尤为关键，棕化工艺，stub 长度控制，孔盘尺寸，层偏控制，阻抗控制等方面对 224G 信号完整性有关键的影响。本报告浅析 PCB 端 224G 面临的挑战，本针对这些挑战，展示我们已经完成或正在进行的解决方案。)