Collaborative design optimization of advanced packaging and high-density interconnection.
(先进封装和高密互连的协同设计优化)

PhD from the University of Washington (Seattle), Vice President of Changdian Technology Group, and General Manager of the Design Services Division. Previously responsible for chip hardware system design and product development in multiple multinational renowned semiconductor companies.
(美国华盛顿大学(西雅图)博士，长电科技集团副总裁，设计服务事业部总经理。曾在多家跨国知名半导体公司负责芯片硬件系统设计和产品开发。)

In today's complex integrated circuit design environment, the high-density interconnect design collaboration of high computing power chips is the key to industry development. As a global leader in packaging and testing technology and chip manufacturing, Changdian Technology has always been at the forefront of this field. The company has developed an advanced cross process design simulation platform and toolchain, realizing the research and development process of integrated analysis of multiple physical fields including electricity, magnetism, force, and heat. This multi-scale and multi-media collaborative development method supports various hybrid designs and promotes the integrated development of heterogeneous integration technology. In the application of packaging technology, Changdian Technology has improved the overall performance of chips, reduced power consumption, and enhanced quality reliability by integrating physical constraints and collaborative parameter optimization technology of microsystem architecture. In addition, the cost reduction and efficiency improvement engineering methodology developed by the company provides strong support for industry technological progress and economic benefits.
(在当今复杂的集成电路设计环境中，大算力芯片的高密互连设计协同是行业发展的关键。作为全球封测技术和芯片成品制造的领导者，长电科技始终处于这一领域的前沿。公司开发了先进跨工艺的设计仿真平台和工具链，实现了电、磁、力、热多物理场融合分析的研发流程。这种多尺度、多介质的协同开发方法支持各种混合设计，推动了异质集成技术的一体化发展。在封装技术应用中，长电科技通过整合物理约束和微系统架构的协同参数优化技术，提高了芯片整体性能，降低了功耗，增强了质量可靠性。此外，公司开发的降本增效工程方法学，为行业技术进步和经济效益提供了强有力的支持。)