New Keynote Speaker Announced
We are pleased to announce an additional keynote speaker for WAI 2026.
Seungyoung Ahn
Korea Advanced Institute of Science and Technology
We are pleased to announce an additional keynote speaker for WAI 2026.
Korea Advanced Institute of Science and Technology
The WAI 2026 Advance Program is now available. Participants are welcome to download the program and review the conference schedule.
We are pleased to announce an additional keynote speaker for WAI 2026.
Dean of the School of Integrated Circuits, Boya Distinguished Professor, doctoral supervisor, and Executive Director of the Innovation Center for Advanced Integrated Circuits at Peking University
Explore the concurrent course offered alongside WAI 2026, including course information and the promotional poster.
View Concurrent CourseWe are pleased to announce two keynote speakers for WAI 2026.
Senior Director, Cable Backplane Systems
Amphenol Communications Solutions
Fellow, IEEE
Missouri University of Science and Technology
Er-Ping Li (Member of the Chinese Academy of Engineering, IEEE Fellow) received the Ph.D. degree in electrical engineering from Sheffield Hallam University, Sheffield, U.K., in 1992., He is currently a Changjiang-Qianren Distinguished Professor with the Department of information Science and Electronic Engineering, Zhejiang University, Hangzhou, China, and the Dean of the Joint Institute of Zhejiang University— University of Illinois at Urbana-Champaign, Zhejiang University.
Since 1989, he has been a Research Fellow, a Principal Research Engineer, an Associate Professor, and a Technical Director with the Singapore Research Institute and University, Singapore. He has authored or coauthored more than 500 papers published in the referred international journals and conferences, authored two books published by John-Wiley-IEEE Press and Cambridge University Press. He holds and has filed a number of patents at the U.S. patent office. His research interests include electrical modeling and design of micro/ nanoscale integrated circuits, three-dimensional electronic package integration, and nanoplasmonic technology.
Dr. Li is a Fellow of the Singapore Academy of Engineering and the USA Electromagnetics Academy. He was the recipient of the IEEE EMC Technical Achievement Award, in 2006, Singapore IES Prestigious Engineering Achievement Award, and Changjiang Chair Professorship Award, in 2007, 2015 IEEE Richard Stoddard Award on EMC, 2021 IEEE EMC Laurence G. Cumming Award, and Zhejiang Natural Science 1st Class Award.
Jun Fan (Fellow, IEEE) received the B.S. and M.S. degrees in electronic engineering from Tsinghua University, Beijing, China, in 1994 and 1997, respectively, and the Ph.D. degree in electrical engineering from the Missouri University of Science and Technology (formerly University of Missouri-Rolla), Rolla, MO, USA, in 2000.
From 2000 to 2007, he was with NCR Corporation, San Diego, CA, USA, as a Consultant Engineer. In July 2007, he joined the Missouri University of Science and Technology and became a tenured Professor in 2016. From October 2018 to August 2020, he was the Cynthia Tang Missouri Distinguished Professor in computer engineering. He was the Director of the Missouri S&T EMC Laboratory, and the Director of the National Science Foundation (NSF) Industry/University Cooperative Research Center (I/UCRC) for Electromagnetic Compatibility (EMC) from 2013 to 2020. He was a Senior Investigator of Missouri S&T Material Research Center. His research interests include hardware design and fundamental research for electromagnetic compatibility (including signal and power integrity) at the levels of integrated circuit, package, PCB and system, and development of specialized design tools and innovative measurement technologies. He was the recipient of the IEEE EMC Society Technical Achievement Award in August 2009 and the Richard R. Stoddart Award for Outstanding Performance in 2022.