Er-Ping Li (Member of the Chinese Academy of Engineering, IEEE Fellow)
received the Ph.D. degree in electrical
engineering from Sheffield Hallam University, Sheffield, U.K., in 1992., He is currently a
Changjiang-Qianren Distinguished Professor with the Department of information Science and Electronic
Engineering, Zhejiang University, Hangzhou, China, and the Dean of the Joint Institute of Zhejiang
University— University of Illinois at Urbana-Champaign, Zhejiang University.
Since 1989, he has been a Research Fellow, a Principal Research Engineer, an Associate Professor, and
a Technical Director with the Singapore Research Institute and University, Singapore. He has
authored or coauthored more than 500 papers published in the referred international journals and
conferences, authored two books published by John-Wiley-IEEE Press and Cambridge University Press.
He holds and has filed a number of patents at the U.S. patent office. His research interests include
electrical modeling and design of micro/ nanoscale integrated circuits, three-dimensional electronic
package integration, and nanoplasmonic technology.
Dr. Li is a Fellow of the Singapore Academy of Engineering and the USA Electromagnetics Academy. He
was the recipient of the IEEE EMC Technical Achievement Award, in 2006, Singapore IES Prestigious
Engineering Achievement Award, and Changjiang Chair Professorship Award, in 2007, 2015 IEEE Richard
Stoddard Award on EMC, 2021 IEEE EMC Laurence G. Cumming Award, and Zhejiang Natural Science 1st
Class Award.