Signal and Power Integrity of Advanced Semiconductor Packaging in the AI Era

Seungyoung Ahn received the B.S., M.S., and Ph.D. degrees from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, in 1998, 2000, and 2005, respectively, in electrical engineering. From 2005 to 2009, he was a Senior Engineer with Samsung Electronics, South Korea, where he was the in charge of high-speed board design for laptop computer systems. He is currently a Professor with the CCS Graduate School of Mobility, KAIST, Daejeon. He has been working in the area of signal and power integrity, wireless power transfer, and electromagnetic compatibility design publishing 300+ international conference and journal papers. He was the Distinguished Lecturer of IEEE EMC Society and the recipient of several awards including Technical Achievement Award 2024 and Motohisa Kanda Award 2021 in IEEE EMC society.

As Moore's Law slows down, advanced semiconductor packaging of 2.5D and 3D heterogeneous integration has emerged as the paramount driver for next generation performance and miniaturization. However, this dense architectural evolution introduces unprecedented challenges, making Signal Integrity (SI) and Power Integrity (PI) critical bottlenecks for high speed, reliable system such as High-Bandwidth Memory (HBM). Addressing these complex multiphysics hurdles requires a paradigm shift in design methodologies. This talk explores the current landscape and future trajectory of advanced packaging technologies, emphasizing SI/PI design management is essential for system performance mentioning the revolutionary role of Machine Learning (ML) in reshaping package design. By leveraging AI-driven optimization and automated co-design, engineers can drastically reduce time-to-market and navigate vast design spaces efficiently. We would like to discuss how the synergy of advanced packaging and AI will shape the future of high-performance computing.