Anfeng Huang (Member, IEEE) received the B.E. and M.S. degrees in electrical engineering from Xidian University, Shaanxi, China, in 2014 and 2017, respectively, and the Ph.D. degree in electrical engineering from the Missouri University of Science and Technology, Rolla, MO, USA, in 2022. He is currently with Detooltech, Ningbo, China. His current research interests include EMI in power electronics, magnetic material characterization, and advanced measurement techniques.

Over 20+ EMC design experience in network equipment and mobile terminals
•vivo software Technology co., Ltd., EMC expert, started 2019
•TD Tech Communications co.,Ltd., EMC expert 2016-2019
•Nokia China, EMC expert, 2011-2015
•H3C, EMC design, 2005-2011

Kaixiang Zhu received the B.S. degree and the Ph.D. degree from Beihang University, Beijing China, in 2013 and 2019. He is currently a Senior Engineer with Honor Device, working towards RF interference, susceptibility of multimedia module and other EMI problems in terminal products.

Kaiming Ding is currently employed at Huaqin Technology Co., Ltd. as a Senior Advanced Engineer, with over 10 years of experience in EMC engineering projects. He is responsible for technical pre-research in the EMC direction at the Group Technology Center and has recently focused on the research and resolution of radio frequency interference, immunity, and nonlinear issues in the consumer electronics field.

Sheng Wenju, a graduate of Wuhan Institute of Technology, is the Director of the High-Frequency & High-Speed Capability Center and the Chief SI & PI Expert in the Terminal Interconnection Department at Huawei Device Co., Ltd. He is also recognized as a Level 7 Expert in Device Board-Level Hardware and Process. He specializes in Signal Integrity (SI) and Power Integrity (PI) engineering for mobile phones, tablets, and PCs in challenging scenarios characterized by high density, high bandwidth, strong interference, and low power consumption.

Chengming Wang received his B.S. (2018) and M.S. (2021) degrees in Information Science and Electronic Engineering from Zhejiang University. He is currently a Senior Engineer at the Simulation Department of Xiaomi Corporation, where his work focuses on solving electromagnetic compatibility (EMC) challenges in mobile devices. His key responsibilities include the simulation and optimization of EMC performance for smartphones.