Join Us in Ningbo, China!
2025 International Workshop
on Advanced Interconnects
November 5 – 7. 2025
Ningbo, China
2025 International Workshop on Advanced Interconnects (WAI) Sponsorship Prospectus
Conference Theme
The Workshop on Advanced Interconnects (WAI) explores the latest advancements and innovations in Signal Integrity (SI), Power Integrity (PI), and Electromagnetic Interference (EMI) for advanced interconnect technologies, spanning integrated circuits, IC packaging, printed circuit boards, and high-speed cable connectors. This event provides a dynamic platform for academia and industry to exchange insights and share cutting-edge research, technical expertise, and industry trends, fostering new collaborations and inspiration.
Sponsorship Benefits
We sincerely invite outstanding enterprises to join us as sponsors and collaborate to advance interconnect technology. Based on your company's needs, you can freely combine the following core benefits to create a customized sponsorship package.
A. Brand Promotion

• Logo Display on Website and Conference Program: Prominent placement of your company logo in the sponsor section of the official conference website and in the printed program booklet, which is essential for all attendees, ensuring exposure before, during, and after the event.

• On-site Promotional Banners: Exclusive promotional banners in high-traffic areas such as the main venue and break zones, effectively reaching every key industry figure.

• Lobby display panels at the main avenue entrance.

• 5-minute promotional video played during pre-dinner networking.

• Branding on conference bags, directional signage, and registration desks.

B. Brand Presentation

• Option to host either a Keynote Speech or a Technical Presentation.

• Dedicated speaking slot in a Panel Discussion

C. Targeted Outreach

• Two-page brochure insertion in all conference bags. Your carefully prepared product introductions, technical white papers, or company updates will be directly distributed to all elite attendees, achieving high-quality, in-depth, and targeted communication.

D. Physical Presence

• Standard Booth or Roll-up Banner: Secure a standard booth in the dedicated exhibition area to engage directly with potential clients and partners for product demonstrations, technical exchanges, and business discussions. Roll-up banners can be added to enhance on-site ambiance.

• Complimentary Conference Registrations: Receive full-access conference registrations for your core team, enabling them to gain cutting-edge knowledge and expand top-tier networks.

• VIP seat at the Gala Dinner.

Join Hands to Connect the Future!
WAI 2025 is your platform to showcase corporate strength, connect with core resources, and lead industry trends. We look forward to collaborating with you to chart a new blueprint for interconnect technology!
For More Information & Sponsorship Inquiries
Tel:+86 183 8058 2006
E-mail:conference@detooltech.com