The 2025 IEEE International Workshop on Advanced Interconnects (WAI
2025) will be held on November 5 - 7, 2025, Ningbo,
China. The research
topics about advanced interconnects focus on but are not limited to:
• Signal integrity (SI) and power integrity (PI) of electronic systems and
components;
• SI/PI co-design;
• Electromagnetic compatibility (EMC) and electromagnetic interference (EMI)
techniques;
• EMC/SI/PI measurement methods;
• Computational electromagnetics in EMC/SI/PI;
• Electrostatic discharge and lightning effects;
• Radio-frequency interference problems;
• Artificial intelligence-assisted EMC/SI/PI related methodologies;
Authors of high-quality SIPI-related papers presented at WAI 2025 will be invited to submit an expanded version of their papers to IEEE Transactions on Signal and Power Integrity. Every paper will be reviewed by the journal in the same manner as all other regular submissions. Submissions will be reviewed to determine if the manuscript includes substantially new technical content beyond the Symposium paper; whether the past work including the Symposium paper or Transaction paper is adequately referenced; and whether the new results are placed in proper context with respect to the prior work and existing state-of-the-art.
Best Student Abstract Award
Awards for the Best Student Abstract(s) will be presented to the winners at the conference. The author must be a full-time student who presents, as the first author, the paper at the conference. Students who wish to participate in this competition must pay for the registration fee and must present their work in person in the Best Student Award competition.