Research on Simulation and Testing of Signal Integrity and Power Integrity

Master's degree in Electromagnetic Field from University of Electronic Science and Technology of China. Joined ZTE Microelectronics in 2021 as a Level 5 Technical Expert in the SIPI field, responsible for SIPI simulation technology and methodology for the packaging team, and serves as the head of the Chengdu Packaging Department. Previously worked at several well-known companies in the industry, offers basic SI simulation courses. Personal public account: <High-Speed Circuits and Signal Integrity>， @Half a RF Engineer

This article mainly introduces the work on SI fitting of encapsulated high-speed ABF materials and the simulation study on PI noise consistency. It focuses on how, during the material fitting process, the return loss SDD11 can be kept within an error of less than 1 dB, and how the PI noise error can be maintained within 5%.